Case ID: M24-053P^

Published: 2024-05-24 15:52:24

Last Updated: 1716565944


Ying-Chen Chen

Technology categories

Advanced Materials/NanotechnologyEnergy & PowerPhysical ScienceSemiconductors, Materials & Processes

Licensing Contacts

Physical Sciences Team

Advanced Sub-µm Semiconductor Memory Chip Manufacturing in Zero-Gravity Environment


With the exponential growth of data, advances in machine learning (ML) and artificial intelligence, and the digital transition of the workplace, there is a strong need to develop next-generation processors for the existing and expanding digital devices. Advanced functional chips are an important component of processor innovation, due to the potential for increased performance with greater functionality. There are many current methods of integrating functional chips, but many are high-cost and require long processing times.

Inkjet printing in particular is a promising alternative process because it provides a non-contact, direct printing method, and etching-free process. For wafer-level manufacturing, inkjet is a highly integrated printing method and can be scalable for various applications.

Invention Description

Researchers at Arizona State University have developed a method for inkjet printing for advanced sub-µm semiconductor chip manufacturing in zero-gravity environments. The µG environment provides beneficial effects for inkjet printing technology that can provide better trench filling and conformity, and less voiding defects for advanced sub-µm semiconductor manufacturing in zero-gravity environments. This technology can replace the current high-cost capital facilities required for conventional CMOS cleanroom processes, and can be used for in-space manufacturing.

Potential Applications

  • In-space manufacturing of semiconductor memory arrays

Benefits and Advantages

  • Improved manufacturing process (etching-free, mask-free, high throughput and produces high density arrays)
  • Lower cost (can replace conventional CMOS cleanroom processes)
  • Enables in-space manufacturing
  • Higher quality (better trench filling and conformity, and less voiding defects)