Background
Recent innovations in semiconductor technology require a range of novel materials capable of supporting technically challenging patterning processes. These materials must meet diverse thermomechanical and optical requirements needed for multi-step fabrication processes. These properties include thermal expansion coefficients, thermal stability, off-gassing, and photoresponsiveness.
Light-based debonding techniques are increasingly used in the field due to lower processing costs and higher control over the process. Among structural adhesives, the imide functionality displays advanced thermal stability along with low static permittivity, chemical stability, and strong dielectric properties. There has been recent research into photodegradable polymers for application to semiconductor patterning and processing including o-nitro benzyl or coumarin containing polymers, including 1,2,3,4-cyclobutane-tetracarboxylic dianhydride (CBDA)-derived systems. However, the previous research on CBDA has been specific to sequential polymerization and imidization processes. There is a need for a technology that can be applied to a wide variety of polymeric systems.
Invention Description
Researchers at Arizona State University have developed a new difunctional, thermally stable monomer capable of imparting photocleavage into a polymeric system. This monomer is made from a cyclobutene bisimide ring that undergoes photocleavage when irradiated with a specific wavelength of light. This technology can replace existing thermal debonding procedures with a light-mediated process, which can be used for light-assisted semiconductor processing at the wafer level.
Potential Applications:
- Semiconductor packaging & processing
- Reversible bonding for polymers
Benefits and Advantages:
- Temperature stability
- Degradability
- Can be incorporated into a wider range of polymer systems